The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2010
Filed:
Dec. 23, 2008
Applicant:
Hyoung Kyu Son, Seoul, KR;
Inventor:
Hyoung Kyu Son, Seoul, KR;
Assignee:
ADP Engineering Co., Ltd., Seongnam-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 19/04 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
Abstract
An apparatus and method for measuring a chuck attachment force are provided. The apparatus is capable of measuring loads applied to a measurement substrate, while the measurement substrate is detached from a chuck, and precisely calculating necessary force through a process of comparing and analyzing values of the measured loads. This may prevent errors in the application of attachment force during a semiconductor manufacturing process. In the semiconductor manufacturing process, when the substrate is detached from a chuck, the substrate may be prevented from being deformed or cracked.