The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Dec. 21, 2012
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Mill-Jer Wang, Hsin-Chu, TW;

Ching-Nen Peng, Hsin-Chu, TW;

Hung-Chih Lin, Hsin-Chu, TW;

Hao Chen, Luzhou, TW;

Chung-Han Huang, New Taipei, TW;

Chung-Sheng Yuan, Hsin-Chu, TW;

Ching-Fang Chen, Taichung, TW;

Wen-Wen Hsieh, New Taipei, TW;

Meng-Lin Chung, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 1/073 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2889 (2013.01); G01R 1/07378 (2013.01);
Abstract

A three-dimensional integrated circuit testing apparatus comprises a probe card configured to couple a device-under-test of a three-dimensional integrated circuit with an automatic testing equipment board having a plurality of testing modules, wherein the probe card comprises a plurality of known good dies of the three-dimensional integrated circuit, a plurality of interconnects of the three-dimensional integrated circuit and a plurality of probe contacts, wherein the probe contacts are configured to couple the probe card with testing contacts of the device-under-test of the three-dimensional integrated circuit.


Find Patent Forward Citations

Loading…