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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9935038 B1

PDFFull Text
Date of Patent:
Apr. 03, 2018

Filed:

Apr. 11, 2012

Semiconductor device packages and methods

Applicants:

Tsung-ding Wang, Tainan, TW;

Hung-jen Lin, Tainan, TW;

Jiun Yi Wu, Zhongli, TW;

Mirng-ji Lii, Sinpu Township, TW;

Chien-hsun Lee, Chu-tung Town, TW;

Inventors:

Tsung-Ding Wang, Tainan, TW;

Hung-Jen Lin, Tainan, TW;

Jiun Yi Wu, Zhongli, TW;

Mirng-Ji Lii, Sinpu Township, TW;

Chien-Hsun Lee, Chu-tung Town, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Hsin-Chu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Zandra Smith

Assistant Examiner:

Abbigale Boyle

Int. Cl.
CPC ...
H01L 23/482 (2006.01); H01L 23/00 (2006.01); H01L 23/528 (2006.01); H01L 23/488 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4824 (2013.01); H01L 23/488 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/528 (2013.01); H01L 24/09 (2013.01); H01L 24/16 (2013.01); H01L 21/563 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/16 (2013.01); H01L 2224/16056 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81385 (2013.01); H01L 2224/81424 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/181 (2013.01);
Abstract

Semiconductor devices packages and methods are disclosed. In one embodiment, a package for a semiconductor device includes a substrate and a contact pad disposed on a first surface of the substrate. The contact pad has a first side and a second side opposite the first side. A conductive trace is coupled to the first side of the contact pad, and an extension of the conductive trace is coupled to the second side of the contact pad. A plurality of bond pads is disposed on a second surface of the substrate.

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