The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Jul. 08, 2016
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Su-Chun Yang, Hsinchu, TW;
Yi-Li Hsiao, Hsinchu, TW;
Tung-Liang Shao, Hsinchu, TW;
Chih-Hang Tung, Chu-Pei, TW;
Chen-Hua Yu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
Methods for forming a chip package are provided. The method includes providing at least one carrier substrate including first semiconductor dies mounted thereon. The method also includes forming a first noble metal layer including nanopores irregularly distributed therein to cover each one of the first semiconductor dies. The method further includes immersing the carrier substrate with the first semiconductor dies into an etchant solution including a fluoride etchant and an oxidizing agent, so that each one of the first semiconductor dies covered by the first noble metal layer is thinned.