The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2018
Filed:
Sep. 25, 2015
Tokyo Electron Limited, Tokyo, JP;
A School Corporation Kansai University, Suita-shi, Osaka, JP;
Shoso Shinguhara, Suita, JP;
Kohei Ota, Suita, JP;
Mitsuaki Iwashita, Nirasaki, JP;
Nobutaka Mizutani, Nirasaki, JP;
TOKYO ELECTRON LIMITED, Tokyo, JP;
A SCHOOL CORPORATION KANSAI UNIVERSITY, Osaka, JP;
Abstract
Adhesion of an underlying diffusion barrier metal film and an electroless copper plating film with respect to an insulating film can be improved. A method for manufacturing a wiring structure includes a process of forming the underlying diffusion barrier metal film, including a base metal with respect to copper, on the insulating film; and a process of forming the electroless copper plating filmon the underlying diffusion barrier metal filmby performing an electroless copper displacement plating process with a copper displacement plating solution. The copper displacement plating solution is an acidic copper displacement plating solution of pH1 to pH4, in which copper ions are contained but a reducing agent for reducing the copper ions is not contained.