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Years Active: 2018
Title: The Innovative Contributions of Shoso Shinguhara
Introduction: Shoso Shinguhara, a noted inventor based in Suita, Japan, has made significant advancements in the field of wiring structures through his inventive skills. With one patent to his name, he has contributed to the technological landscape, notably in manufacturing techniques.
Latest Patents: Shinguhara's patent is titled "Method for manufacturing wiring structure, copper displacement plating solution, and wiring structure." This innovative method addresses the adhesion challenges between an underlying diffusion barrier metal film and electroless copper plating film concerning an insulating film. The process involves forming an underlying diffusion barrier metal film on the insulating film, followed by applying an electroless copper plating film using a copper displacement plating solution. This solution, characterized by an acidic pH range of 1 to 4, contains copper ions but does not include a reducing agent for the copper ions, enhancing the efficacy of the plating process.
Career Highlights: Throughout his career, Shoso Shinguhara has been associated with notable companies, including Tokyo Electron Limited and Kansai University. His work has solidified his role as an influential figure in the development and application of plating technologies.
Collaborations: Shinguhara has collaborated with esteemed colleagues such as Kohei Ota and Mitsuaki Iwashita. These partnerships reflect a shared commitment to innovation and improvement in the manufacturing processes within the technology sector.
Conclusion: Shoso Shinguhara's contributions to the patent landscape exemplify how innovative thinking can lead to practical solutions in technology. His work on wiring structures not only pushes the envelope of what is possible but also paves the way for future advancements in the field.