Company Filing History:
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Years Active: 2018
Title: Kohei Ota: Innovator in Wiring Structure Manufacturing
Introduction
Kohei Ota, an inventive mind hailing from Suita, Japan, has made significant contributions to the field of wiring structure manufacturing. With a patent to his name, Ota's work showcases innovative methods that enhance the performance and reliability of electronic components.
Latest Patents
Ota's notable patent, titled "Method for manufacturing wiring structure, copper displacement plating solution, and wiring structure," focuses on improving the adhesion between an underlying diffusion barrier metal film and an electroless copper plating film with respect to an insulating film. This invention describes a comprehensive method that includes the formation of the underlying diffusion barrier metal film, incorporating a base metal for copper, followed by an electroless copper plating process utilizing a specialized copper displacement plating solution. The solution is characterized by its acidic property, with a pH range of 1 to 4, ensuring the presence of copper ions without any reducing agents.
Career Highlights
Throughout his career, Kohei Ota has collaborated with leading companies in the technology sector, including Tokyo Electron Limited and Kansai University. His expertise in the field has allowed him to delve into complex challenges related to manufacturing processes, ultimately leading to the development of innovative solutions.
Collaborations
In his journey as an inventor, Ota has worked alongside esteemed colleagues such as Shoso Shinguhara and Mitsuaki Iwashita. These collaborations have fostered a creative environment that encourages the exchange of ideas and advancements in technology.
Conclusion
Kohei Ota represents the new wave of inventors who are committed to driving innovation in electronics manufacturing. His sole patent not only reflects his technical prowess but also highlights the importance of continuous improvement in industrial processes. As the industry evolves, Ota's contributions will undoubtedly play a pivotal role in shaping future advancements.