The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2018

Filed:

Feb. 25, 2013
Applicants:

Tokyo Electron Limited, Tokyo, JP;

Kyoto University, Kyoto, JP;

Inventors:

Jiro Matsuo, Kyoto, JP;

Toshio Seki, Kyoto, JP;

Takaaki Aoki, Kyoto, JP;

Kazuya Dobashi, Yamanashi, JP;

Kensuke Inai, Yamanashi, JP;

Misako Saito, Yamanashi, JP;

Assignees:

Tokyo Electron Limited, Tokyo, JP;

Kyoto University, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 5/00 (2006.01); H01L 21/67 (2006.01); H01L 21/02 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67028 (2013.01); H01L 21/02046 (2013.01); H01L 21/02063 (2013.01); H01L 21/67023 (2013.01); H01L 22/12 (2013.01);
Abstract

A substrate cleaning method for removing particles adhered to a substrate includes: acquiring particle information including diameters of the particles adhered to the substrate; controlling, based on the acquired particle information, a factor related to sizes of gas clusters having aggregates of atoms or molecules of a cleaning gas; ejecting the cleaning gas, at a higher pressure than a processing atmosphere where the substrate is provided, to the processing atmosphere and generating the gas clusters by adiabatic expansion; and removing the particles by irradiating the gas clusters in a perpendicular direction to a surface of the substrate. As a result, even if recesses for a circuit pattern are formed on the surface of the substrate, the particles in the recesses can be removed at a high removal rate.


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