The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2018
Filed:
Apr. 14, 2014
Kla-tencor Corporation, Milpitas, CA (US);
Andrei V. Shchegrov, Campbell, CA (US);
Jonathan M. Madsen, Los Altos, CA (US);
Stilian Ivanov Pandev, Santa Clara, CA (US);
Ady Levy, Sunnyvale, CA (US);
Daniel Kandel, Aseret, IL;
Michael E. Adel, Zichron Ya'akov, IL;
Ori Tadmor, Haifa, IL;
KLA-Tencor Corporation, Milpitas, CA (US);
Abstract
Methods and systems for performing semiconductor metrology directly on device structures are presented. A measurement model is created based on measured training data collected from at least one device structure. The trained measurement model is used to calculate process parameter values, structure parameter values, or both, directly from measurement data collected from device structures of other wafers. In some examples, measurement data from multiple targets is collected for model building, training, and measurement. In some examples, the use of measurement data associated with multiple targets eliminates, or significantly reduces, the effect of under layers in the measurement result, and enables more accurate measurements. Measurement data collected for model building, training, and measurement may be derived from measurements performed by a combination of multiple, different measurement techniques.