The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

Oct. 24, 2014
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Hitoshi Kato, Iwate, JP;

Hiroyuki Kikuchi, Iwate, JP;

Masato Yonezawa, Iwate, JP;

Jun Sato, Iwate, JP;

Shigehiro Miura, Iwate, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/02 (2006.01); C23C 16/458 (2006.01); C23C 16/505 (2006.01); C23C 16/455 (2006.01); H01J 37/32 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02211 (2013.01); C23C 16/4584 (2013.01); C23C 16/45538 (2013.01); C23C 16/45551 (2013.01); C23C 16/505 (2013.01); H01J 37/3244 (2013.01); H01J 37/32513 (2013.01); H01J 37/32568 (2013.01); H01L 21/0228 (2013.01); H01L 21/02164 (2013.01); H01L 21/02219 (2013.01); H01L 21/02274 (2013.01); H01L 21/31138 (2013.01);
Abstract

A substrate processing apparatus includes a vacuum chamber including a top plate, a rotary table rotatably disposed in the vacuum chamber, a first process gas supply part that supplies a first process gas to be adsorbed on a surface of a substrate placed on the rotary table, a plasma processing gas supply part that is disposed apart from the first process gas supply part in a circumferential direction of the rotary table and supplies a second process gas to the surface of the substrate, a separation gas supply part that supplies a separation gas for separating the first process gas and the second process gas, a plasma generator that converts the second process gas into plasma, and an elevating mechanism that moves at least one of the plasma generator and the rotary table upward and downward.


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