The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2017
Filed:
Nov. 30, 2016
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventors:
Tai-I Yang, Hsinchu, TW;
Jung-I Lin, Hsinchu, TW;
Ta-Chun Lin, Zhubei, TW;
Tien-Lu Lin, Hsinchu, TW;
Chen-Jong Wang, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/764 (2006.01); H01L 27/146 (2006.01); H01L 27/092 (2006.01); H01L 29/94 (2006.01); H01L 21/768 (2006.01); H01L 21/762 (2006.01); H01L 21/8234 (2006.01); H01L 21/8238 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/764 (2013.01); H01L 21/7682 (2013.01); H01L 21/76224 (2013.01); H01L 21/76227 (2013.01); H01L 21/76289 (2013.01); H01L 21/76834 (2013.01); H01L 21/823481 (2013.01); H01L 21/823878 (2013.01); H01L 27/0921 (2013.01); H01L 27/1203 (2013.01); H01L 27/1463 (2013.01); H01L 27/14612 (2013.01); H01L 27/14632 (2013.01); H01L 27/14643 (2013.01); H01L 27/14654 (2013.01); H01L 27/14689 (2013.01); H01L 29/945 (2013.01);
Abstract
A method for manufacturing an image sensor with deep trench spacing isolation is provided. A trench is formed in a semiconductor substrate, around and between a plurality of pixel regions of the semiconductor substrate. A cap is formed using epitaxy to seal a gap between sidewalls of the trench. Pixel sensors corresponding to the plurality of pixel regions are formed over or within the corresponding pixel regions. An image sensor resulting from the method is also provided.