The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2017
Filed:
Aug. 31, 2015
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Tzu-Chun Tang, Kaohsiung, TW;
Shou Zen Chang, Taipei County, TW;
Wei-Ting Chen, Tainan, TW;
In-Tsang Lin, Kaohsiung, TW;
Vincent Chen, Taipei, TW;
Chuei-Tang Wang, Taichung, TW;
Kai-Chiang Wu, Hsinchu, TW;
Chun-Lin Lu, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor structure includes a substrate, a die disposed over the substrate, and including a die pad disposed over the die and a seal ring disposed at a periphery of the die and electrically connected with the die pad, a polymeric layer disposed over the die, a via extending through the polymeric layer and electrically connected with the die pad, and a molding disposed over the substrate and surrounding the die and the polymeric layer, wherein the seal ring is configured for grounding.