The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Apr. 06, 2016
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Satya Kurada, Fremont, CA (US);

Raghav Babulnath, San Jose, CA (US);

Kwok Ng, Milpitas, CA (US);

Lisheng Gao, Morgan Hill, CA (US);

Assignee:

KLA-Tencor Corp., Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06T 7/00 (2006.01); G01N 21/956 (2006.01); G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0006 (2013.01); G01N 21/9501 (2013.01); G01N 21/956 (2013.01); G01N 21/95607 (2013.01); G06T 7/001 (2013.01); G06T 7/0008 (2013.01); G01N 2021/95676 (2013.01); G01N 2201/068 (2013.01); G01N 2201/06113 (2013.01); G01N 2201/10 (2013.01); G01N 2201/12 (2013.01); G06K 9/00 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Methods and systems for design based sampling and binning for yield critical defects are provided. One method includes aligning each image patch in each inspection image frame generated for a wafer by an optical subsystem of an inspection system to design information for the wafer. The method also includes deriving multiple layer design attributes at locations of defects detected in the image patches. In addition, the method includes building a decision tree with the multiple layer design attributes. The decision tree is used to separate the defects into bins with different yield impacts on a device being formed on the wafer. The method also includes binning the defects with the decision tree.


Find Patent Forward Citations

Loading…