The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Dec. 09, 2014
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Tai-I Yang, Hsinchu, TW;

Jung-I Lin, Hsinchu, TW;

Ta-Chun Lin, Zhubei, TW;

Tien-Lu Lin, Hsinchu, TW;

Chen-Jong Wang, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/148 (2006.01); H01L 29/768 (2006.01); H01L 29/00 (2006.01); H01L 27/146 (2006.01); H01L 27/092 (2006.01); H01L 29/94 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1463 (2013.01); H01L 27/0921 (2013.01); H01L 27/1203 (2013.01); H01L 27/14632 (2013.01); H01L 27/14643 (2013.01); H01L 27/14654 (2013.01); H01L 27/14689 (2013.01); H01L 29/945 (2013.01);
Abstract

An image sensor employing deep trench spacing isolation is provided. A plurality of pixel sensors is arranged over or within a semiconductor substrate. A trench is arranged in the semiconductor substrate around and between adjacent ones of the plurality of pixel sensors, and the trench has a gap located between sidewalls of the trench. A cap is arranged over or within the trench at a position overlying the gap. The cap seals the gap within the trench. A method of manufacturing the image sensor is also provided.


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Yang, Tai-I. (2017). Deep trench spacing isolation for complementary metal-oxide-semiconductor (cmos) image sensors (U.S. Patent No. 9559134). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9559134

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