The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2016
Filed:
Mar. 12, 2013
Invensas Corporation, San Jose, CA (US);
Terrence Caskey, Santa Cruz, CA (US);
Ilyas Mohammed, Santa Clara, CA (US);
Cyprian Emeka Uzoh, San Jose, CA (US);
Charles G. Woychik, San Jose, CA (US);
Michael Newman, Dublin, CA (US);
Pezhman Monadgemi, Fremont, CA (US);
Reynaldo Co, Santa Cruz, CA (US);
Ellis Chau, San Jose, CA (US);
Belgacem Haba, Saratoga, CA (US);
Invensas Corporation, San Jose, CA (US);
Abstract
A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds.