The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
Jul. 07, 2011
Pei-chun Tsai, Zhongli, TW;
Sheng-yu Wu, Hsin-Chu, TW;
Ching-wen Hsiao, Banqiao, TW;
Tin-hao Kuo, Hsin-Chu, TW;
Chen-shien Chen, Zhubei, TW;
Chung-shi Liu, Hsin-Chu, TW;
Chien-hsiun Lee, Hsin-Chu, TW;
Mirng-ji Lii, Sinpu Township, TW;
Pei-Chun Tsai, Zhongli, TW;
Sheng-Yu Wu, Hsin-Chu, TW;
Ching-Wen Hsiao, Banqiao, TW;
Tin-Hao Kuo, Hsin-Chu, TW;
Chen-Shien Chen, Zhubei, TW;
Chung-Shi Liu, Hsin-Chu, TW;
Chien-Hsiun Lee, Hsin-Chu, TW;
Mirng-Ji Lii, Sinpu Township, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A package-on-package (PoP) comprises a substrate with a plurality of substrate traces, a first function chip on top of the substrate connected to the substrate by a plurality of bond-on-trace connections, and a second function chip on top of the first function chip, directly connected to the substrate. Another package-on-package (PoP) comprises: a substrate with a plurality of substrate traces, a first function chip on top of the substrate connected to the substrate by a plurality of solder mask defined (SMD) connections formed on SMD bonding pads connected to solder bumps, and a second function chip on top of the first function chip, directly connected to the substrate by a plurality of bond-on-trace connections.