The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2016

Filed:

Jun. 11, 2013
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Mill-Jer Wang, Hsin-Chu, TW;

Ching-Nen Peng, Hsin-Chu, TW;

Hung-Chih Lin, Hsin-Chu, TW;

Hao Chen, Luzhou, TW;

Shang-Ju Lee, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G01R 31/3185 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/318511 (2013.01); G01R 31/2889 (2013.01); G01R 31/318513 (2013.01);
Abstract

A system for testing a wafer includes a probe card and a wafer. The probe card includes at least one first probe site and at least one second probe site. The wafer includes a plurality of dies. The at least one first probe site is arranged for a first test, and the at least one second probe site is arranged for a second test. Each of the plurality of dies corresponds to first probe pads and second probe pads. Each of the at least one first probe site is arranged to touch the first probe pads of each of the plurality of dies. Each of the at least one second probe site is arranged to touch the second probe pads of each of the plurality of dies.


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