logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9425093 B1

PDFFull Text
Date of Patent:
Aug. 23, 2016

Filed:

Dec. 05, 2014

Copper wiring forming method, film forming system, and storage medium

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Tadahiro Ishizaka, Nirasaki, JP;

Takashi Sakuma, Nirasaki, JP;

Osamu Yokoyama, Nirasaki, JP;

Kai-Hung Yu, Albany, NY (US);

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorneys:

Nath, Goldberg & Meyer

Jerald L. Meyer

Primary Examiner:

Mohsen Ahmadi

Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 21/285 (2006.01); C23C 16/52 (2006.01); C23C 14/24 (2006.01); C23C 14/54 (2006.01); C23C 14/34 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76879 (2013.01); C23C 14/24 (2013.01); C23C 14/34 (2013.01); C23C 14/54 (2013.01); C23C 16/52 (2013.01); H01L 21/2855 (2013.01); H01L 21/28556 (2013.01); H01L 21/28568 (2013.01); H01L 21/76843 (2013.01); H01L 23/528 (2013.01); H01L 23/53238 (2013.01); H01L 23/53266 (2013.01);
Abstract

A Cu wiring forming method of forming Cu wiring that is to be arranged in contact with tungsten wiring, by filling Cu into a recess formed in a substrate, includes: removing a tungsten oxide formed on a surface of the tungsten wiring; forming a nitriding preventing film at least on the surface of the tungsten wiring in the recess; forming a barrier film that prevents diffusion of Cu, on a surface in the recess from above the nitriding preventing film; forming a liner film on the barrier film; and filling a Cu film on the liner film.

Find Patent Forward Citations

Ishizaka, Tadahiro. (2016). Copper wiring forming method, film forming system, and storage medium (U.S. Patent No. 9425093). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9425093

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…