The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

Jul. 08, 2014
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Chun-Chieh Chuang, Tainan, TW;

Dun-Nian Yaung, Taipei, TW;

Feng-Chi Hung, Chu-Bei, TW;

Min-Feng Kao, Chiayi, TW;

Jeng-Shyan Lin, Tainan, TW;

Chun-Ming Su, Kaohsiung, TW;

Ching-Chun Wang, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 27/146 (2006.01); H01L 23/48 (2006.01); H01L 21/48 (2006.01); H01L 23/58 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 21/486 (2013.01); H01L 23/481 (2013.01); H01L 23/585 (2013.01); H01L 27/1464 (2013.01); H01L 27/1469 (2013.01); H01L 27/14634 (2013.01); H01L 27/14687 (2013.01); H01L 23/3114 (2013.01); H01L 23/522 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Semiconductor devices, methods of manufacturing thereof, and image sensor devices are disclosed. In some embodiments, a semiconductor device includes a semiconductor chip comprising an array region, a periphery region, and a through-via disposed therein. A guard structure is disposed in the semiconductor chip between the array region and the through-via or between the through-via and a portion of the periphery region. A portion of the guard structure is disposed within a substrate of the semiconductor chip.


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