The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Dec. 03, 2012
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Chuan-Ling Wu, Changhua County, TW;
Cheng-Hsien Chuang, Tainan, TW;
Chun-Chang Chen, Tainan, TW;
Wang-Pen Mo, Pingtung County, TW;
Hung-Chang Hsieh, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method of fabricating integrated circuit devices is provided. The method includes forming a plurality of spaced integrated circuit dies on a semiconductor wafer and forming a dedicated test die on the semiconductor wafer adjacent the plurality of spaced integrated circuit dies, the dedicated test die including a test structure having a first width when viewed in a top view and being operable to generate wafer evaluation data. Further, the method includes forming a scribe line region interposed between the plurality of spaced integrated circuit dies, the scribe line region having a second width defined by a distance between adjacent integrated circuit dies when viewed in a top view, the second width being smaller than the first width, and the scribe line region being free of test structures.