The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2016
Filed:
Mar. 18, 2014
Chung-shan Institute of Science and Technology Armaments Bureau, M.n.d., Longtan Township, TW;
Shao-Chung Hu, Longtan Township, TW;
Kuo-Yang Horng, Longtan Township, TW;
Ling-Yueh Yang, Longtan Township, TW;
Wei-Ching Liu, Longtan Township, TW;
Pen-Shan Chao, Longtan Township, TW;
Kun-Feng Chen, Longtan Township, TW;
Louis Lu-Chen Hsu, Longtan Township, TW;
Abstract
A microelectronic 3D packaging structure and a method of manufacturing the same are introduced. The microelectronic 3D packaging structure includes a first board with a plurality of a first edges and disposed with a first electronic device; a second board with a plurality of a second edges and disposed with a second electronic device, wherein at least one second edge of the second board is jointed to at least one first edge of the first board to form a joint line; and a joint connection portion disposed at the joint line of the two adjacent boards and adapted to function as a connection path for transmitting signals.