Kuo-Yang Horng

Title: Kuo-Yang Horng: Innovator in Microelectronic 3D Packaging

Introduction

Kuo-Yang Horng is a distinguished inventor based in Longtan, Taiwan. He has made significant contributions to the field of microelectronics, particularly in the area of 3D packaging structures. His innovative work has led to advancements that enhance the efficiency and functionality of electronic devices.

Latest Patents

Kuo-Yang Horng holds a patent for a microelectronic 3D packaging structure and the method of manufacturing the same. This patent introduces a novel design that includes a first board with multiple edges, which is equipped with a first electronic device. Additionally, it features a second board that also has multiple edges and is equipped with a second electronic device. Notably, at least one edge of the second board is joined to an edge of the first board, forming a joint line. A joint connection portion is situated at this joint line, serving as a connection path for signal transmission.

Career Highlights

Kuo-Yang Horng is affiliated with the National Chung Shan Institute of Science and Technology, where he continues to push the boundaries of microelectronic research. His work is characterized by a commitment to innovation and excellence in technology development.

Collaborations

He has collaborated with notable colleagues such as Shao-Chung Hu and Ling-Yueh Yang, contributing to a dynamic research environment that fosters creativity and technological advancement.

Conclusion

Kuo-Yang Horng's contributions to microelectronic 3D packaging represent a significant leap forward in the field. His innovative patent and collaborative efforts highlight his role as a key figure in advancing technology.