National Chung Shan Institute of Science and Technology

Kuo-Yang Horng

Kun-Feng Chen

Shao-Chung Hu

Wei-Ching Liu

Pen-Shan Chao

Ling-Yueh Yang

Louis Lu-Chen Hsu

A microelectronic 3D packaging structure and a method of manufacturing the same are introduced. The microelectronic 3D packaging structure includes a first board with a plurality of a first edges and disposed with a first electronic device; a second board with a plurality of a second edges and disposed with a second electronic device, wherein at least one second edge of the second board is jointed to at least one first edge of the first board to form a joint line; and a joint connection portion disposed at the joint line of the two adjacent boards and adapted to function as a connection path for transmitting signals.

Growing community of inventors

Longtan, Taiwan

Kuo-Yang Horng