This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: National Chung Shan Institute of Science and Technology. Active years: 2016.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2016
Title: Pen-Shan Chao: Innovator in Microelectronic 3D Packaging
Introduction
Pen-Shan Chao is a notable inventor based in Longtan, Taiwan. He has made significant contributions to the field of microelectronics, particularly in the area of 3D packaging structures. His innovative work has led to the development of advanced technologies that enhance the performance and efficiency of electronic devices.
Latest Patents
One of Pen-Shan Chao's key patents is titled "Microelectronic 3D packaging structure and method of manufacturing the same." This patent introduces a microelectronic 3D packaging structure that includes a first board with multiple edges, which is equipped with a first electronic device. Additionally, it features a second board with several edges, housing a second electronic device. Notably, at least one edge of the second board is joined to an edge of the first board, forming a joint line. A joint connection portion is situated at this joint line, serving as a connection path for signal transmission. This innovative design is crucial for improving the integration and functionality of microelectronic systems. Pen-Shan Chao holds 1 patent.
Career Highlights
Pen-Shan Chao is affiliated with the National Chung Shan Institute of Science and Technology, where he continues to advance his research and development efforts. His work is characterized by a commitment to innovation and excellence in the field of microelectronics.
Collaborations
Throughout his career, Pen-Shan Chao has collaborated with esteemed colleagues, including Shao-Chung Hu and Kuo-Yang Horng. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and the pursuit of groundbreaking advancements in technology.
Conclusion
Pen-Shan Chao's contributions to microelectronic 3D packaging represent a significant advancement in the field. His innovative patent and collaborative efforts highlight his dedication to enhancing electronic device performance. His work continues to influence the future of microelectronics and inspire new generations of inventors.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile