Wei-Ching Liu

Title: Wei-Ching Liu: Innovator in Microelectronic 3D Packaging

Introduction

Wei-Ching Liu is a prominent inventor based in Longtan, Taiwan. He has made significant contributions to the field of microelectronics, particularly in the area of 3D packaging structures. His innovative work has led to the development of advanced technologies that enhance the performance and efficiency of electronic devices.

Latest Patents

Wei-Ching Liu holds a patent for a microelectronic 3D packaging structure and the method of manufacturing the same. This patent introduces a microelectronic 3D packaging structure that includes a first board with multiple first edges, which is equipped with a first electronic device. Additionally, it features a second board with several second edges, housing a second electronic device. Notably, at least one second edge of the second board is joined to at least one first edge of the first board, forming a joint line. A joint connection portion is situated at this joint line, serving as a connection path for transmitting signals. This innovative design is crucial for improving the integration and functionality of microelectronic systems.

Career Highlights

Wei-Ching Liu is affiliated with the National Chung Shan Institute of Science and Technology, where he has been instrumental in advancing research and development in microelectronics. His expertise and innovative mindset have positioned him as a key figure in his field.

Collaborations

Throughout his career, Wei-Ching Liu has collaborated with notable colleagues, including Shao-Chung Hu and Kuo-Yang Horng. These collaborations have fostered a dynamic environment for innovation and have contributed to the success of various projects.

Conclusion

Wei-Ching Liu's contributions to microelectronic 3D packaging technology exemplify his commitment to innovation and excellence. His work not only enhances the capabilities of electronic devices but also paves the way for future advancements in the field.