Ling-Yueh Yang

Title: Ling-Yueh Yang: Innovator in Microelectronic 3D Packaging

Introduction

Ling-Yueh Yang is a prominent inventor based in Longtan, Taiwan. She has made significant contributions to the field of microelectronics, particularly in the area of 3D packaging structures. Her innovative work has led to the development of a unique method for manufacturing microelectronic devices.

Latest Patents

One of her notable patents is titled "Microelectronic 3D packaging structure and method of manufacturing the same." This patent introduces a microelectronic 3D packaging structure that includes a first board with multiple edges, which is equipped with a first electronic device. Additionally, it features a second board with several edges, housing a second electronic device. A key aspect of this invention is the joint line formed by connecting at least one edge of the second board to one edge of the first board. The joint connection portion at this line serves as a pathway for signal transmission, enhancing the efficiency of microelectronic devices. Ling-Yueh Yang holds 1 patent for this innovative technology.

Career Highlights

Ling-Yueh Yang is affiliated with the National Chung Shan Institute of Science and Technology, where she continues to advance her research and development efforts in microelectronics. Her work has garnered attention for its potential applications in various electronic devices.

Collaborations

Throughout her career, Ling-Yueh Yang has collaborated with esteemed colleagues, including Shao-Chung Hu and Kuo-Yang Horng. These partnerships have contributed to the advancement of her research and the successful development of her patented technologies.

Conclusion

Ling-Yueh Yang is a trailblazer in the field of microelectronic 3D packaging, with her innovative patent showcasing her expertise and dedication to advancing technology. Her contributions are poised to make a lasting impact on the microelectronics industry.