This inventor holds 1 USPTO granted patent. Top assignee: National Chung Shan Institute of Science and Technology. Active years: 2016.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2016
Title: Louis Lu-Chen Hsu: Innovator in Microelectronic 3D Packaging
Introduction
Louis Lu-Chen Hsu is a prominent inventor based in Longtan, Taiwan. He has made significant contributions to the field of microelectronics, particularly in the area of 3D packaging structures. His innovative work has led to the development of advanced technologies that enhance the performance and efficiency of electronic devices.
Latest Patents
Hsu holds a patent for a microelectronic 3D packaging structure and the method of manufacturing the same. This patent introduces a microelectronic 3D packaging structure that includes a first board with multiple first edges, which is equipped with a first electronic device. Additionally, it features a second board with several second edges, housing a second electronic device. Notably, at least one second edge of the second board is joined to at least one first edge of the first board, forming a joint line. A joint connection portion is situated at this joint line, serving as a connection path for transmitting signals. Hsu's patent is a testament to his innovative approach in the microelectronics domain, with 1 patent to his name.
Career Highlights
Louis Lu-Chen Hsu is affiliated with the National Chung Shan Institute of Science and Technology, where he has been instrumental in advancing research and development in microelectronics. His work has not only contributed to academic knowledge but has also had practical applications in the industry.
Collaborations
Hsu has collaborated with notable colleagues, including Shao-Chung Hu and Kuo-Yang Horng. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Louis Lu-Chen Hsu is a key figure in the field of microelectronics, with a focus on 3D packaging structures. His contributions through patents and collaborations highlight his commitment to advancing technology in this critical area. His work continues to influence the development of more efficient electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile