The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2016
Filed:
Oct. 28, 2013
Intel Corporation, Santa Clara, CA (US);
Rajasekaran Swaminathan, Tempe, AZ (US);
Ram S. Viswanath, Phoenix, AZ (US);
Sanka Ganesan, Chandler, AZ (US);
Gaurav Chawla, Tempe, AZ (US);
Joshua D. Heppner, Chandler, AZ (US);
Jeffory L. Smalley, East Olympia, WA (US);
Vijaykumar Krithivasan, Chandler, AZ (US);
David J. Llapitan, Tacoma, WA (US);
Neal E. Ulen, Yelm, WA (US);
Donald T. Tran, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments related to integrated circuit (IC) connectors are described. In some embodiments, an IC assembly may include an IC package substrate, an intermediate member, and a male connector. The IC package substrate may have first signal contacts on a top or bottom surface, and the bottom surface may have second signal contacts for coupling with a socket on a circuit board. The intermediate member may have a first end coupled to the first signal contacts and a second end extending beyond the side surface. The male connector may be disposed at the second end of the intermediate member, and may have signal contacts coupled to the signal contacts of the intermediate member. The male connector may be mateable with a female connector when the female connector is brought into engagement in a direction parallel to the axis of the intermediate member. Other embodiments may be disclosed and/or claimed.