The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2016

Filed:

Oct. 02, 2013
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Tatsuo Hirasawa, Nirasaki, JP;

Osamu Yokoyama, Nirasaki, JP;

Chiaki Yasumuro, Nirasaki, JP;

Toshiaki Fujisato, Nirasaki, JP;

Ryota Yoshida, Nirasaki, JP;

Takashi Sakuma, Nirasaki, JP;

Cheonsoo Han, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05H 1/24 (2006.01); H05F 3/00 (2006.01); C23C 16/50 (2006.01); C23C 14/34 (2006.01); C23C 14/50 (2006.01); H01J 37/34 (2006.01); H01L 21/683 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H05F 3/00 (2013.01); C23C 14/34 (2013.01); C23C 14/50 (2013.01); C23C 16/50 (2013.01); H01J 37/32568 (2013.01); H01J 37/34 (2013.01); H01L 21/6833 (2013.01);
Abstract

In a plasma processing method, plasma processing is performed in a state where the object is attracted and held on the electrostatic chuck by applying a first voltage as an application voltage thereto and a thermal conduction gas is supplied to a gap between the electrostatic chuck and the object. The application voltage is decreased while stopping the supply of the thermal conduction gas and exhausting the thermal conduction gas remaining between the electrostatic chuck and the object upon completion of the plasma processing. The object is separated from the electrostatic chuck by setting the application voltage to the electrostatic chuck to zero after the application voltage is decreased.


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