The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

May. 02, 2014
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Christopher Dennis Bencher, Cupertino, CA (US);

Daniel Lee Diehl, Chiba, JP;

Huixiong Dai, San Jose, CA (US);

Yong Cao, San Jose, CA (US);

Tingjun Xu, San Jose, CA (US);

Weimin Zeng, San Jose, CA (US);

Peng Xie, Fremont, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/033 (2006.01); H01L 21/02 (2006.01); H01L 21/027 (2006.01); H01L 21/3105 (2006.01); C23C 14/00 (2006.01); C23C 14/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0337 (2013.01); C23C 14/0042 (2013.01); C23C 14/06 (2013.01); H01L 21/0214 (2013.01); H01L 21/0276 (2013.01); H01L 21/02126 (2013.01); H01L 21/02266 (2013.01); H01L 21/0332 (2013.01); H01L 21/3105 (2013.01); H01L 21/31138 (2013.01); H01L 21/31144 (2013.01);
Abstract

The embodiments herein provides methods for forming a PVD silicon oxide or silicon rich oxide, or PVD SiN or silicon rich SiN, or SiC or silicon rich SiC, or combination of the preceding including a variation which includes controlled doping of hydrogen into the compounds heretofore referred to as SiONC:H, where w, x, y, and z can vary in concentration from 0% to 100%, is produced as a hardmask with optical properties that are substantially matched to the photo-resists at the exposure wavelength. Thus making the hardmask optically planarized with respect to the photo-resist. This allows for multiple sequences of litho and etches in the hardmask while the photo-resist maintains essentially no optical topography or reflectivity variations.


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