The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Jul. 02, 2014
Applicant:

Efficient Power Conversion Corporation, El Segundo, CA (US);

Inventors:

Chunhua Zhou, El Segundo, CA (US);

Jianjun Cao, Torrance, CA (US);

Alexander Lidow, Marina Del Rey, CA (US);

Robert Beach, La Crescenta, CA (US);

Alana Nakata, Redondo Beach, CA (US);

Robert Strittmatter, Tujunga, CA (US);

Guangyuan Zhao, Torrance, CA (US);

Seshadri Kolluri, San Jose, CA (US);

Yanping Ma, Torrance, CA (US);

Fang Chang Liu, Taiwan, TW;

Ming-Kun Chiang, Hsinchu, TW;

Jiali Cao, Torrance, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/778 (2006.01); H01L 29/30 (2006.01); H01L 29/20 (2006.01); H01L 29/66 (2006.01); H01L 21/76 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/2003 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01); H01L 21/76 (2013.01); H01L 27/0605 (2013.01); H01L 29/778 (2013.01);
Abstract

An integrated semiconductor device which includes a substrate layer, a buffer layer formed on the substrate layer, a gallium nitride layer formed on the buffer layer, and a barrier layer formed on the gallium nitride layer. Ohmic contacts for a plurality of transistor devices are formed on the barrier layer. Specifically, a plurality of first ohmic contacts for the first transistor device are formed on a first portion of the surface of the barrier layer, and a plurality of second ohmic contacts for the second transistor device are formed on a second portion of the surface of the barrier layer. In addition, one or more gate structures formed on a third portion of the surface of the barrier between the first and second transistor devices. Preferably, the one or more gate structures and the spaces between the gate structures and the source contacts of the transistor devices collectively form an isolation region that electrically isolates the first transistor device from the second transistor device.


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