The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Apr. 14, 2011
Sivakumar Dhandapani, San Jose, CA (US);
Jun Qian, Sunnyvale, CA (US);
Christopher D. Cocca, Fremont, CA (US);
Jason G. Fung, Sunnyvale, CA (US);
Shou-sung Chang, Mt. View, CA (US);
Charles C. Garretson, Sunnyvale, CA (US);
Gregory E. Menk, Pleasanton, CA (US);
Stan D. Tsai, Fremont, CA (US);
Sivakumar Dhandapani, San Jose, CA (US);
Jun Qian, Sunnyvale, CA (US);
Christopher D. Cocca, Fremont, CA (US);
Jason G. Fung, Sunnyvale, CA (US);
Shou-Sung Chang, Mt. View, CA (US);
Charles C. Garretson, Sunnyvale, CA (US);
Gregory E. Menk, Pleasanton, CA (US);
Stan D. Tsai, Fremont, CA (US);
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Abstract
Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.