The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2015
Filed:
Jan. 29, 2013
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventors:
Yen-Chen Lin, Hsinchu, TW;
Ching-Hsin Chang, Hemei Township, TW;
Chia-Hung Chu, Pingzhen, TW;
Hu-Wei Lin, Hsinchu, TW;
Chih-Hsien Hsu, Hsinchu, TW;
Hong-Hsing Chou, Jhubei, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/36 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); G03F 7/16 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0387 (2013.01); G03F 7/039 (2013.01); G03F 7/162 (2013.01);
Abstract
A method comprises dispensing a first solvent on a semiconductor substrate; dispensing a first layer of a high-viscosity polymer on the first solvent; dispensing a second solvent on the first layer of high-viscosity polymer; and spinning the semiconductor substrate after dispensing the second solvent, so as to spread the high-viscosity polymer to a periphery of the semiconductor substrate.