The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Aug. 08, 2013
Tokyo Electron Limited, Minato-ku, JP;
Tadahiro Ishizaka, Yamanashi, JP;
Atsushi Gomi, Yamanashi, JP;
Kenji Suzuki, Yamanashi, JP;
Tatsuo Hatano, Yamanashi, JP;
Hiroyuki Toshima, Yamanashi, JP;
Yasushi Mizusawa, Tokyo, JP;
TOKYO ELECTRON LIMITED, Minato-ku, JP;
Abstract
A Cu wiring forming method forms Cu wiring in a recess of a predetermined pattern including a trench formed in an insulating film on a substrate surface. The method includes: forming a barrier film at least on a surface of the recess; forming a Cu film by PVD to fill the recess with the Cu film; forming an additional layer on the Cu film; polishing an entire surface by CMP to form the Cu wiring in the recess; forming a metal cap including a manganese oxide film on an entire surface including the insulating film and the Cu wiring of the substrate after performing the CMP polishing; and forming a dielectric cap on the metal cap.