The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2015

Filed:

Jun. 13, 2014
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Tzu-Yen Hsieh, Taipei, TW;

Chang Ming-Ching, Hsinchu, TW;

Chun-Hung Lee, Zhudong Town, TW;

Yih-Ann Lin, Jhudong Township, TW;

De-Fang Chen, Lujhu Township, TW;

Chao-Cheng Chen, Shin-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/265 (2006.01); H01L 21/033 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H01L 21/3215 (2006.01);
U.S. Cl.
CPC ...
H01L 21/26506 (2013.01); H01L 21/0338 (2013.01); H01L 21/0337 (2013.01); H01L 21/31144 (2013.01); H01L 21/32134 (2013.01); H01L 21/32139 (2013.01); H01L 21/32155 (2013.01); H01L 21/311 (2013.01);
Abstract

A method of forming an integrated circuit includes forming a patterned mask layer on a material layer, the patterned mask layer having a plurality of first features with a first pitch. The method includes patterning the material layer by using the patterned mask layer as a mask to form the first features in the material layer. The method includes trimming the patterned mask layer, after patterning the material layer, to form a trimmed patterned mask layer. The method further includes introducing a plurality of dopants into the material layer exposed by the trimmed patterned mask layer to form doped regions having a second pitch, wherein the second pitch is different from the first pitch. The method further includes removing the trimmed patterned mask layer to expose un-doped regions in the material layer; and removing the un-doped regions to form a plurality of second features corresponding to the respective doped regions.


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