The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2015
Filed:
Jan. 26, 2012
Bryan Buckalew, Tualatin, OR (US);
Jonathan Reid, Sherwood, OR (US);
John Sukamto, Lake Oswego, OR (US);
Zhian He, Tigard, OR (US);
Seshasayee Varadarajan, Lake Oswego, OR (US);
Steven T. Mayer, Lake Oswego, OR (US);
Bryan Buckalew, Tualatin, OR (US);
Jonathan Reid, Sherwood, OR (US);
John Sukamto, Lake Oswego, OR (US);
Zhian He, Tigard, OR (US);
Seshasayee Varadarajan, Lake Oswego, OR (US);
Steven T. Mayer, Lake Oswego, OR (US);
Novellus Systems, Inc., Fremont, CA (US);
Abstract
In a copper electroplating apparatus having separate anolyte and catholyte portions, the concentration of anolyte components (e.g., acid or copper salt) is controlled by providing a diluent to the recirculating anolyte. The dosing of the diluent can be controlled by the user and can follow a pre-determined schedule. For example, the schedule may specify the diluent dosing parameters, so as to prevent precipitation of copper salt in the anolyte. Thus, precipitation-induced anode passivation can be minimized.