The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2015
Filed:
Dec. 28, 2011
Jing-cheng Lin, Hsinchu County, TW;
Jui-pin Hung, Hsinchu, TW;
Nai-wei Liu, Fengshan, TW;
Yi-chao Mao, Zhongli, TW;
Wan-ting Shih, Touwu Township, TW;
Tsan-hua Tung, Hsinchu, TW;
Jing-Cheng Lin, Hsinchu County, TW;
Jui-Pin Hung, Hsinchu, TW;
Nai-Wei Liu, Fengshan, TW;
Yi-Chao Mao, Zhongli, TW;
Wan-Ting Shih, Touwu Township, TW;
Tsan-Hua Tung, Hsinchu, TW;
Abstract
The mechanisms of forming a molding compound on a semiconductor device substrate to enable fan-out structures in wafer-level packaging (WLP) are provided. The mechanisms involve covering portions of surfaces of an insulating layer surrounding a contact pad. The mechanisms improve reliability of the package and process control of the packaging process. The mechanisms also reduce the risk of interfacial delamination, and excessive outgassing of the insulating layer during subsequent processing. The mechanisms further improve planarization end-point. By utilizing a protective layer between the contact pad and the insulating layer, copper out-diffusion can be reduced and the adhesion between the contact pad and the insulating layer may also be improved.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile