The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Sep. 02, 2011
Applicants:

Atsushi Gomi, Nirasaki, JP;

Yasushi Mizusawa, Nirasaki, JP;

Tatsuo Hatano, Nirasaki, JP;

Masamichi Hara, Nirasaki, JP;

Kaoru Yamamoto, Nirasaki, JP;

Satoshi Taga, Nirasaki, JP;

Chiaki Yasumuro, Nirasaki, JP;

Inventors:

Atsushi Gomi, Nirasaki, JP;

Yasushi Mizusawa, Nirasaki, JP;

Tatsuo Hatano, Nirasaki, JP;

Masamichi Hara, Nirasaki, JP;

Kaoru Yamamoto, Nirasaki, JP;

Satoshi Taga, Nirasaki, JP;

Chiaki Yasumuro, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/50 (2006.01); C23C 16/00 (2006.01); C23F 1/00 (2006.01); H01L 21/306 (2006.01); H01L 21/687 (2006.01); C23C 16/44 (2006.01); C23C 16/458 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68785 (2013.01); C23C 16/4404 (2013.01); C23C 16/4412 (2013.01); C23C 16/4585 (2013.01); C23C 16/4586 (2013.01); H01L 21/67109 (2013.01);
Abstract

Provided is a mounting table structure for use in forming a thin film on a surface of a target object mounted on the mounting table structure by using a raw material gas including an organic metal compound in a processing chamber. The mounting table structure includes: a mounting table main body which mounts thereon the target object and has therein a heater; and a base which supports the mounting table main body while surrounding a side surface and a bottom surface of the mounting table main body, the base having therein a coolant path where a coolant flows therethrough and being maintained at a temperature higher than the solidification temperature or the liquefaction temperature of the raw material gas, but lower than the decomposition temperature of the raw material gas.


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