The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2014

Filed:

Dec. 14, 2010
Applicants:

Anthony DE LA Llera, Fremont, CA (US);

Allan K. Ronne, Santa Clara, CA (US);

Jaehyun Kim, Fremont, CA (US);

Jason Augustino, Fremont, CA (US);

Rajinder Dhindsa, San Jose, CA (US);

Yen-kun Wang, Union City, CA (US);

Saurabh J. Ullal, South San Francisco, CA (US);

Anthony J. Norell, Newark, CA (US);

Keith Comendant, Fremont, CA (US);

William M. Denty, Jr., San Jose, CA (US);

Inventors:

Anthony De La Llera, Fremont, CA (US);

Allan K. Ronne, Santa Clara, CA (US);

Jaehyun Kim, Fremont, CA (US);

Jason Augustino, Fremont, CA (US);

Rajinder Dhindsa, San Jose, CA (US);

Yen-Kun Wang, Union City, CA (US);

Saurabh J. Ullal, South San Francisco, CA (US);

Anthony J. Norell, Newark, CA (US);

Keith Comendant, Fremont, CA (US);

William M. Denty, Jr., San Jose, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Components of a plasma processing apparatus includes a backing member with gas passages attached to an upper electrode with gas passages. To compensate for the differences in coefficient of thermal expansion between the metallic backing member and upper electrode, the gas passages are positioned and sized such that they are misaligned at ambient temperature and substantially concentric at an elevated processing temperature. Non-uniform shear stresses can be generated in the elastomeric bonding material, due to the thermal expansion. Shear stresses can either be accommodated by applying an elastomeric bonding material of varying thickness or using a backing member comprising of multiple pieces.


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