The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2014
Filed:
Mar. 17, 2011
Wen-yuan Chang, New Taipei, TW;
Yu-kai Chen, New Taipei, TW;
Yeh-chi Hsu, New Taipei, TW;
Ying-ni Lee, New Taipei, TW;
Wei-chih Lai, New Taipei, TW;
Wen-Yuan Chang, New Taipei, TW;
Yu-Kai Chen, New Taipei, TW;
Yeh-Chi Hsu, New Taipei, TW;
Ying-Ni Lee, New Taipei, TW;
Wei-Chih Lai, New Taipei, TW;
VIA Technologies, Inc., New Taipei, TW;
Abstract
An integrated circuit (IC) package includes an IC chip and a package carrier. The IC chip includes a substrate and an IC layered structure configured on an active surface of the substrate. The IC layered structure includes a first physical layer interface and a second physical layer interface. The first physical layer interface includes a plurality of first bump pads and a plurality of first inner pads electrically connected to the first bump pads, respectively. The second physical layer interface includes a plurality of second bump pads and a plurality of second inner pads electrically connected to the second bump pads, respectively. The second bump pads are mirror images of the first bump pads with respect to a first geometric plane perpendicular to the active surface. The second inner pads are mirror images of the first inner pads with respect to the first geometric plane.