Taipei, Taiwan

Ying-Ni Lee


Average Co-Inventor Count = 2.9

ph-index = 2

Forward Citations = 7(Granted Patents)


Location History:

  • Hsin-Tien, TW (2009)
  • New Taipei, TW (2014)

Company Filing History:


Years Active: 2009-2014

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2 patents (USPTO):Explore Patents

Title: Innovations of Ying-Ni Lee

Introduction

Ying-Ni Lee is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of integrated circuit technology. With a total of 2 patents to his name, his work has had a notable impact on the industry.

Latest Patents

Ying-Ni Lee's latest patents include an integrated circuit package and a physical layer interface arrangement. The integrated circuit (IC) package features an IC chip and a package carrier. The IC chip consists of a substrate and an IC layered structure configured on the active surface of the substrate. This layered structure includes a first physical layer interface and a second physical layer interface, with both interfaces containing bump pads and inner pads that are electrically connected. The second bump pads and inner pads are designed as mirror images of their first counterparts, enhancing the functionality of the IC package.

Another significant patent involves the arrangement of non-signal through vias suitable for a wiring board. This arrangement includes first and second non-signal through vias that are strategically placed to optimize electrical connections to contact pads on the wiring board. The design ensures that the interval between the second non-signal through via and surrounding first non-signal through vias is carefully calculated to maintain efficiency.

Career Highlights

Ying-Ni Lee is currently employed at Via Technologies, Inc., where he continues to innovate and develop new technologies. His expertise in integrated circuits and wiring board arrangements has positioned him as a valuable asset to the company.

Collaborations

Ying-Ni Lee has collaborated with notable coworkers, including Hsing-Chou Hsu and Wen-Yuan Chang. Their combined efforts contribute to the advancement of technology within their field.

Conclusion

Ying-Ni Lee's contributions to integrated circuit technology and his innovative patents reflect his dedication to advancing the industry. His work continues to influence the development of new technologies, showcasing the importance of innovation in today's world.

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