Company Filing History:
Years Active: 2014-2016
Title: Wei-Chih Lai: Innovator in Chip Packaging and Power Control Devices
Introduction
Wei-Chih Lai is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the fields of chip packaging and power control devices. With a total of 4 patents to his name, Lai's work reflects his innovative spirit and technical expertise.
Latest Patents
Lai's latest patents include a chip package structure and a power control device using a status latch module. The chip package structure features a carrier and a chip group, which consists of a pair of identical integrated circuit (IC) chips. These chips are arranged in opposite directions and parallel to each other, ensuring efficient electrical connection with the carrier. The power control device is designed for electronic devices and includes a power switching unit that outputs a DC power source to a load based on a power switching signal. It also incorporates a switching detection unit and a status latch module that generates the power switching signal, enhancing the device's functionality.
Career Highlights
Throughout his career, Wei-Chih Lai has worked with notable companies such as Via Technologies, Inc. and Wistron Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in technology.
Collaborations
Lai has collaborated with talented individuals in his field, including Wen-Yuan Chang and Yeh-Chi Hsu. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.
Conclusion
Wei-Chih Lai's contributions to chip packaging and power control devices highlight his role as an influential inventor. His innovative patents and collaborations demonstrate his commitment to advancing technology in meaningful ways.