Yu-Kai Chen

Title: Yu-Kai Chen: Innovator in Integrated Circuit Technology

Introduction

Yu-Kai Chen is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of integrated circuit technology, holding a total of 2 patents. His work focuses on enhancing the functionality and efficiency of circuit carriers and integrated circuit chips.

Latest Patents

Yu-Kai Chen's latest patents include innovative designs that improve the performance of electronic components. One of his patents is for a pad structure suitable for a circuit carrier or an integrated circuit chip. This pad structure features an inner pad, a conductive via, and an outer pad. The conductive via connects the inner pad, while the outer pad connects the conductive via and further connects to a conductive ball or bump. Notably, the outer diameter of the outer pad is greater than that of the inner pad. Another significant patent is for an integrated circuit package and physical layer interface arrangement. This IC package includes an IC chip and a package carrier, with a substrate and an IC layered structure configured on the active surface of the substrate. The layered structure comprises two physical layer interfaces, each with a series of bump pads and inner pads that are mirror images of each other.

Career Highlights

Yu-Kai Chen is currently employed at Via Technologies, Inc., where he continues to innovate in the field of integrated circuits. His work has been instrumental in advancing the technology used in electronic devices.

Collaborations

Some of his notable coworkers include Yeh-Chi Hsu and Wen-Yuan Chang, who collaborate with him on various projects within the company.

Conclusion

Yu-Kai Chen's contributions to integrated circuit technology through his patents demonstrate his commitment to innovation in the electronics industry. His work continues to influence the development of advanced electronic components.