The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2014
Filed:
Nov. 16, 2011
Jung Wei Cheng, Hsin-Chu, TW;
Chien-hsiun Lee, Chu-Tung Town, TW;
Tsung-ding Wang, Tainan, TW;
Chun-chih Chuang, Taichung, TW;
Jung Wei Cheng, Hsin-Chu, TW;
Chien-Hsiun Lee, Chu-Tung Town, TW;
Tsung-Ding Wang, Tainan, TW;
Chun-Chih Chuang, Taichung, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method includes placing a mold chase over a bottom package, wherein the bottom package has a connector at a top surface of the bottom package. The mold chase includes a cover, and a pin under and connected to the cover. The pin occupies a space extending from a top surface of the connector to the cover. A polymer is filled into a space between the cover of the mold chase and the bottom package. The polymer is then cured. After the step of curing the polymer, the mold chase is removed, and the connector is exposed through an opening in the polymer, wherein the opening is left by the pin of the mold chase.