The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2013

Filed:

Jul. 12, 2010
Applicants:

Allen Park, San Jose, CA (US);

Ellis Chang, Saratoga, CA (US);

Masami Aoki, Kanagawa, JP;

Chris Chih-chien Young, Palo Alto, CA (US);

Martin Plihal, Pleasanton, CA (US);

Michael John Van Riet, Sunnyvale, CA (US);

Inventors:

Allen Park, San Jose, CA (US);

Ellis Chang, Saratoga, CA (US);

Masami Aoki, Kanagawa, JP;

Chris Chih-Chien Young, Palo Alto, CA (US);

Martin Plihal, Pleasanton, CA (US);

Michael John Van Riet, Sunnyvale, CA (US);

Assignee:

KLA—Tencor Corporation, Milpitas, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2011.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01);
Abstract

A system and method of matching multiple scanners using design and defect data are described. A golden wafer is processed using a golden tool. A second wafer is processed using a second tool. Both tools provide focus/exposure modulation. Wafer-level spatial signatures of critical structures for both wafers can be compared to evaluate the behavior of the scanners. Critical structures can be identified by binning defects on the golden wafer having similar patterns. In one embodiment, the signatures must match within a certain percentage or the second tool is characterized as a 'no match'. Reticles can be compared in a similar manner, wherein the golden and second wafers are processed using a golden reticle and a second reticle, respectively.


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