The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Oct. 15, 2009
Mari Nozoe, Hino, JP;
Hiroshi Miyai, Hitachi, JP;
Mitsuru Okamura, Mito, JP;
Makoto Suzuki, Hitachinaka, JP;
Yusuke Ominami, Hitachinaka, JP;
Mari Nozoe, Hino, JP;
Hiroshi Miyai, Hitachi, JP;
Mitsuru Okamura, Mito, JP;
Makoto Suzuki, Hitachinaka, JP;
Yusuke Ominami, Hitachinaka, JP;
Hitachi High-Technologies Corporation, Tokyo, JP;
Abstract
Provided is a pattern inspection apparatus including: a charge formation means which forms charge on a surface of a substrate () by generating an electron beam from a second electron source () which is different from an electron source () which generates an electron beam before irradiating an electron beam (), a current measuring means () which measures a value of current flowing in the substrate while the charge is formed on the surface of the substrate by the charge formation means; and an adjustment means () which adjusts the charge formed by the charge formation means so that the value of the current measured by the current measuring means is a predetermined target value. Provided is also a pattern inspection method which uses the pattern inspection apparatus. Thus, it is possible to easily set an optimal condition of precharge executed before inspection of a pattern formed by a semiconductor apparatus manufacturing process and automatically inspection whether the precharge is good. Then, the inspection result is fed back to the operation afterward. This prevents lowering of the reliability of the inspection result and always enables a stable inspection.