The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2013

Filed:

Aug. 04, 2009
Applicants:

Atsushi Gomi, Nirasaki, JP;

Yasushi Mizusawa, Nirasaki, JP;

Tatsuo Hatano, Nirasaki, JP;

Masamichi Hara, Nirasaki, JP;

Kaoru Yamamoto, Nirasaki, JP;

Chiaki Yasumuro, Nirasaki, JP;

Inventors:

Atsushi Gomi, Nirasaki, JP;

Yasushi Mizusawa, Nirasaki, JP;

Tatsuo Hatano, Nirasaki, JP;

Masamichi Hara, Nirasaki, JP;

Kaoru Yamamoto, Nirasaki, JP;

Chiaki Yasumuro, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25J 1/00 (2006.01); F25J 1/02 (2006.01); C23C 16/00 (2006.01); B01D 47/00 (2006.01); B01J 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A raw material recovery method for recovering a raw material of an organic metallic compound, which has the property of being stable toward a specific refrigerant without being decomposed thereby, from exhaust gas discharged from a treatment container in which a metallic thin film is formed on the surface of an object to be treated by using source gas obtained by vaporizing the raw material is characterized by being provided with a solidification step for solidifying the unreacted source gas by cooling the exhaust gas by bringing the exhaust gas into contact with the refrigerant and reprecipitating the raw material, and a recovery step for separating and recovering the raw material reprecipitated in the solidification step from the refrigerant. To provide a method for controlling an exhaust gas flow rate so that flow of gas in a processing chamber becomes uniform.


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