The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2013
Filed:
Mar. 24, 2008
Applicants:
Chen-hua Yu, Hsin-Chu, TW;
Jui-pin Hung, Hsinchu, TW;
Weng-jin Wu, Hsinchu, TW;
Jean Wang, Hsin-Chu, TW;
Wen-chih Chiou, Miaoli, TW;
Inventors:
Chen-Hua Yu, Hsin-Chu, TW;
Jui-Pin Hung, Hsinchu, TW;
Weng-Jin Wu, Hsinchu, TW;
Jean Wang, Hsin-Chu, TW;
Wen-Chih Chiou, Miaoli, TW;
Assignee:
Taiwan Semiconductor Manufacturing Comany, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present disclosure provides a bonding apparatus. The bonding apparatus includes a cleaning module designed for cleaning chips; and a chip-to-wafer bonding chamber configured to receive the chips from the cleaning module and designed for bonding the chips to a wafer.