The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2012
Filed:
Aug. 08, 2007
Shinji Himori, Nirasaki, JP;
Shoichiro Matsuyama, Nirasaki, JP;
Atsushi Matsuura, Nirasaki, JP;
Hiroshi Inazumachi, Funabashi, JP;
Mamoru Kosakai, Narashino, JP;
Yukio Miura, Funabashi, JP;
Keigo Maki, Ichikawa, JP;
Shinji Himori, Nirasaki, JP;
Shoichiro Matsuyama, Nirasaki, JP;
Atsushi Matsuura, Nirasaki, JP;
Hiroshi Inazumachi, Funabashi, JP;
Mamoru Kosakai, Narashino, JP;
Yukio Miura, Funabashi, JP;
Keigo Maki, Ichikawa, JP;
Tokyo Electron Limited, , JP;
Abstract
An electrostatic chuck device includes an electrostatic chuck section, a metal base section, and a dielectric plate. The electrostatic chuck section has a substrate, a main surface of which serves as a mounting surface for a plate-like sample, an electrostatic-adsorption inner electrode built in the substrate, and a power supply terminal for applying a DC voltage to the electrostatic-adsorption inner electrode. Here, a dielectric plate is fixed to a concave portion formed in the metal base section. The dielectric plate and the electrostatic chuck section are adhesively bonded to each other with an insulating adhesive bonding layer interposed therebetween. The dielectric plate and the concave portion are adhesively bonded to each other with a conductive adhesive bonding layer interposed therebetween, the volume resistivity of which is 1.0×10Ωcm or less.