The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2012

Filed:

Aug. 04, 2010
Applicants:

Shosuke Endoh, Nirasaki, JP;

Noriyuki Iwabuchi, Miyagi-gun, JP;

Shigeaki Kato, Nirasaki, JP;

Tomoya Okubo, Nirasaki, JP;

Jun Hirose, Nirasaki, JP;

Koichi Nagakura, Nirasaki, JP;

Chishio Koshimizu, Nirasaki, JP;

Kazuki Denpoh, Nirasaki, JP;

Inventors:

Shosuke Endoh, Nirasaki, JP;

Noriyuki Iwabuchi, Miyagi-gun, JP;

Shigeaki Kato, Nirasaki, JP;

Tomoya Okubo, Nirasaki, JP;

Jun Hirose, Nirasaki, JP;

Koichi Nagakura, Nirasaki, JP;

Chishio Koshimizu, Nirasaki, JP;

Kazuki Denpoh, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

A plasma processing apparatus having a focus ring, enables the efficiency of cooling of the focus ring to be greatly improved, while preventing an increase in cost thereof. The plasma processing apparatus is comprised of a susceptor which has an electrostatic chuck and the focus ring. A wafer W to be subjected to plasma processing is mounted on the electrostatic chuck. The focus ring has a dielectric material portion and a conductive material portion. The dielectric material portion forms a contact portion disposed in contact with the electrostatic chuck. The conductive material portion faces the electrostatic chuck with the dielectric material portion therebetween.


Find Patent Forward Citations

Loading…